BOE and ECHINT Boost China’s TGV Glass Substrate Technology Growth

BOE, ECHINT, and Others Drive China’s Progress in TGV Glass Substrate Tech

China is enhancing the TGV glass substrate technology with the entry of ECHINT, BOE, and other leaders. The ijiwei quoted CNpowder as a chip packaging technology that has reached an advancement. Alongside the glass substrate TGV, it has established itself as the focal point of industry interest. The glass substrates are a critical technology for advanced semiconductor packaging. The technology is gaining traction due to its excellent heat dissipation, flatness, and conductivity. They mitigate deformation risks compared to organic materials, making them fundamental for packaging high-powered and long-lasting chips.

 Advanced applications, such as silicon photonics and server module integration in glass substrates, are a suitable and optimal option for semiconductor packaging. The Chinese glass substrate TGV key players, such as BOE, Sky Semiconductor, and 3D CHIPS, are consistently and dedicatedly establishing relevant technologies and have already developed various TGV packaging production pipelines.

Highlights of the Key Players Contributing to Tech-packaging

The 3D CHIPS, a wholly owned subsidiary of Chengdu Micro-technology, focuses on materials and the unification of technologies for 3D microsystems. It’s said to be the first company to introduce TGV 3.0, with its successful milestone of a breakthrough in sub-10-micron filling and through-via technology.

The BOE’s known for its expertise in display technology and the establishment of semiconductor packaging solutions, highlighted by TGV. Its newest 8-inch pilot line is operational with its groundbreaking performance in areas such as high aspect-ratio TGV and high-density 3D interconnect. BOE also launched its standard glass core substrates for AI chips, with massive production expected to begin after 2026.

The Sky Semiconductor aims for advanced system and packaging integration. Its wafer-level packaging shipments in TGV are claimed to qualify 20,000 units. The company achieved a milestone in 4-micron through-diameter technology and advocated 2.5D high-density glass interposer technology in 2024. Its products contribute significantly to the packaging of large chips for CPUs, GPUs, and AI applications. The WG tech’s operations, which explore optoelectronic glass processing, display modules, and backlighting, with the help of advanced glass-related packaging substrates, have been one of the impressive and strategic businesses.

China has been witnessing development in TGV glass substrate technology due to initiatives by key players, performance improvements, and advancements. Furthermore, these players will contribute to enhancing the growth and potential of China’s tech sector and economy. This attracts new business and partnerships in the leading advanced semiconductor packaging industry. The space for technology to flourish is a key achievement for China.